Odisha Launches ₹2,000-Crore Semiconductor Unit
Bhubaneswar: In a significant boost to Odisha’s ambitions in the semiconductor sector, Chief Minister Mohan Charan Majhi and Union Minister for Electronics & IT and Railways Ashwini Vaishnaw on Sunday laid the foundation stone for a ₹2,000-crore 3D glass substrate packaging unit at Infovally in Khordha.
The project, being developed by 3D Glass Solutions, is expected to generate around 2,500 jobs and position Odisha as an emerging hub for advanced semiconductor manufacturing in the country.
Addressing the gathering, Vaishnaw said the facility would usher in a new phase of industrial and technological growth in the state. He highlighted that the unit would manufacture advanced glass substrate packaging components for the first time in India, adding that the technology represents the future of the global semiconductor industry.
Chief Minister Majhi termed the initiative a landmark moment for both Odisha and the country’s technological aspirations. He noted that the facility would be India’s first advanced 3D glass substrate packaging unit, catering to emerging sectors such as artificial intelligence, high-performance computing, and defence electronics.
Emphasising Odisha’s growing appeal among global investors, Majhi said multinational companies like Intel, Lockheed Martin, and Applied Materials are associated with the project, reflecting increasing confidence in the state’s industrial ecosystem.
He further stated that Odisha has already attracted investments exceeding ₹10,000 crore in the semiconductor sector, with companies such as RIR Power Electronics and SiCSEM having established their presence in the state.
“Odisha will play a key role in the vision of a self-reliant India envisioned by the Prime Minister Narendra Modi and will serve as a launchpad for industrial growth in eastern India,” Majhi said.
Highlighting the state’s advantages, the Chief Minister pointed to abundant natural resources, strong infrastructure, a skilled workforce, improved connectivity, and responsive governance as key factors attracting investments. He also urged the youth to seize opportunities in the fast-growing semiconductor sector by upgrading their skills.
Officials said that once operational, the facility will have an annual production capacity of 70,000 glass panels, 50 million assembled units, and 13,200 advanced 3DHI modules.
The event was attended by State Electronics & Information Technology Minister Dr Mukesh Mahaling, Chief Secretary Anu Garg, Additional Chief Secretary Vishal Kumar Dev, Additional Secretary Amitesh Kumar Sinha, and 3D Glass Solutions President and CEO Babu Mandava, among other dignitaries.
